Item

Description

Layer

Flex board: 1-6Layers
Flex-Rigid Board: 2-8Layers

Material

PI, PET, PEN, FR-4

Final Thickness

Flex board: 0.002" - 0.1" (0.05-2.5mm)
Flex-rigid board: 0.0024" - 0.16" (0.06-4.0mm)

Surface Treatment

Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin

Max / Min Board Size

Min: 0.2"x0.3"  Max: 20.5"x13"

Min Trace
Width / Min Clearance

Inner: 0.5oz: 4/4mil  Outer: 1/3oz-0.5oz: 4/4mil
1oz: 5/5mil               1oz: 5/5mil
2oz: 5/7mil               2oz: 5/7mil

Min Hole Ring

Inner: 0.5oz: 4mil     Outer: 1/3oz-0.5oz: 4mil
1oz: 5mil                  1oz: 5mil
2oz: 7mil                  2oz: 7mil

Copper Thickness

1/3oz - 2oz

Max / Min Insulation Thickness

2mil/0.5mil (50um/12.7um)

Min Hole Size and Tolerance

Min hole: 8mil
Tolerance: PTH±3mil, NPTH±2mil

Min Slot

24mil x 35mil (0.6x0.9mm)

Solder Mask Alignment Tolerance

±3mil

Silkscreen Alignment Tolerance

±6mil

Silkscreen Line Width

5mil

Gold Plating

Nickel: 100u" - 200u"

Gold: 1u"-4u"

Immersion Nickel / Gold

Nickel: 100u" - 200u"

Gold: 1u"-5u"

Immersion Silver

Silver: 6u" - 12u"

OSP

Film: 8u" - 20u"

Test Voltage

Testing Fixture: 50-300V

Profile Tolerance of Punch

Accurate mould: ±2mil

Ordinary mould: ±4mil

Knife mould: ±8mil

Hand-Cut: ±15mil